DDD Group Says Samsung Completes Development Stage for Embedded 3-D HDTV Chip

DDD Group plc, the 3D software and content company, today announces that Samsung Electronics Company Ltd. has completed the prototype development phase for the integration of DDD's TriDef 3-D functions into a low cost 3-D chip for Samsung's next generation 3-D HDTVs.

The agreement was announced in February this year and involved DDD and Samsung collaborating to implement DDD's TriDef real-time 2-D to 3-D conversion and 3-D image processing architecture. The development fee of approximately £107,000 has been received based on the successful achievement of all the technical milestones for the prototype chip that was completed as expected within the first half of 2008.

Following completion of the prototype development phase, market research is now underway with consumers and Hollywood studios prior to commencing the next phase of the project.

Chris Yewdall, Chief Executive of DDD said: 'We are pleased to report that the development phase of this project is now complete with Samsung's engineers having successfully implementing our TriDef 2-D to 3-D conversion in their prototype 3-D HDTVs. Interest in the emerging 3-D TV market continues to grow and we remain squarely focused on building upon our lead and securing further development and licensing agreements in the TV market.'

Source: Hemscott